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產(chǎn)品系列

羅斌森

  • MSP430F1121AIRGER

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430x1xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 8MHz
    Peripherals : POR, WDT
    Number of I/O : 14
    Program Memory Size : 4KB (4K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 256 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : Slope A/D
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 24-VFQFN Exposed Pad
    Supplier Device Package : 24-VQFN (4x4)

極速報價

型號
 品牌 封裝 批號 查看
LP5952TL-0.7/NOPB TI 5-DSBGA (1.41x1.08) New 詳細(xì)
ADS6142IRHB25 TI 32-VQFN (5x5) New 詳細(xì)
LP5996SD-3308 TI 10-SON (3x3) New 詳細(xì)
PCM1800E/2K TI 24-SSOP New 詳細(xì)
THS4011IDGNR TI 8-MSOP-PowerPad New 詳細(xì)
TPS65100RGER TI 24-VQFN (4x4) New 詳細(xì)
BUF16821BIPWPR TI 28-HTSSOP New 詳細(xì)
LP2989IM-1.8 TI 8-SOIC New 詳細(xì)
CY74FCT157ATDE4 TI 16-SOIC New 詳細(xì)
UC3524N TI 16-PDIP New 詳細(xì)
TPS92602BQPWPRQ1 TI 28-HTSSOP New 詳細(xì)
DS125BR401EVM TI New 詳細(xì)
SN74AVCH2T45YZPR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 詳細(xì)
TL780-12CKC TI TO-220-3 New 詳細(xì)
TS5A3160DCKR TI SC-70-6 New 詳細(xì)
SN74LVC2G32YZPR TI 8-DSBGA, 8-WCSP (1.9x0.9) New 詳細(xì)
TPA0252PWP TI 24-HTSSOP New 詳細(xì)
TMDS570LS12HDK TI New 詳細(xì)
LP2951CMMX-3.3 TI 8-VSSOP New 詳細(xì)
LP2989ILDX-2.5 TI 8-WSON (4x4) New 詳細(xì)