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羅斌森

  • VSC8584XKS-09

  • Manufacturer : Microchip Technology
    Packaging : Tray
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

極速報(bào)價(jià)

型號(hào)
 品牌 封裝 批號(hào) 查看
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PIC24F08KL401-I/SS Microchip 20-SSOP New 詳細(xì)
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25LC160D-I/ST Microchip 8-TSSOP New 詳細(xì)
MCP1812AT-012/TT Microchip SOT-23-3 New 詳細(xì)
ENC28J60T/ML Microchip 28-QFN (6x6) New 詳細(xì)
AT17LV040-10BJC Microchip 44-PLCC (16.6x16.6) New 詳細(xì)
PIC18F4685-I/P Microchip 40-PDIP New 詳細(xì)
PIC18F1330-I/SS Microchip 20-SSOP New 詳細(xì)
MIC39151-1.65BU Microchip TO-263-5 New 詳細(xì)
PIC16LF15375T-I/PT Microchip 44-TQFP (10x10) New 詳細(xì)
MCP14E10-E/MF Microchip 8-DFN-S (6x5) New 詳細(xì)
AT24C02D-SSHM-B Microchip 8-SOIC New 詳細(xì)
TC6501P085VCTTR Microchip SOT-23-5 New 詳細(xì)
PIC12C508AT-04I/SN Microchip New 詳細(xì)
PIC16F877AT-I/L Microchip 44-PLCC (16.59x16.59) New 詳細(xì)
MIC5319-1.85YD5 Microchip TSOT-23-5 New 詳細(xì)
MIC45208-2YMP-EV Microchip New 詳細(xì)