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產(chǎn)品系列

羅斌森

  • VSC8584XKS-06

  • Manufacturer : Microchip Technology
    Packaging : Tray
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

極速報價

型號
 品牌 封裝 批號 查看
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