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羅斌森

  • FES10J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

極速報(bào)價(jià)

型號(hào)
 品牌 封裝 批號(hào) 查看
UC3844D ON 14-SOP New 詳細(xì)
NCV8502D100G ON 8-SOIC New 詳細(xì)
FSB50250US ON New 詳細(xì)
74AC125SC ON 14-SOIC New 詳細(xì)
2N7051_D10Z ON TO-92-3 New 詳細(xì)
1N5261B_T50R ON DO-35 New 詳細(xì)
KAI-16000-AAA-JP-B1 ON 40-PGA (44.45x45.34) New 詳細(xì)
FMKA130L ON SMA (DO-214AC) New 詳細(xì)
FDN336P-NL ON SuperSOT-3 New 詳細(xì)
FAN8831MPX ON 24-MLP (4x4) New 詳細(xì)
2N7002ET1G ON SOT-23-3 (TO-236) New 詳細(xì)
AR0135CS2C00SUEAH3-GEVB ON New 詳細(xì)
TL431BVDR2 ON 8-SOIC New 詳細(xì)
MC74LCX06DTR2G ON 14-TSSOP New 詳細(xì)
FOD817BSD ON 4-SMD New 詳細(xì)
NTD78N03-035 ON I-PAK New 詳細(xì)
NCV4299D1 ON 8-SOIC New 詳細(xì)
TS-GEVB ON New 詳細(xì)
MMBTA06_L98Z ON SOT-23-3 New 詳細(xì)
MR854 ON DO-201AD New 詳細(xì)